The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Feb. 02, 2011
Applicants:

Daisuke Fukuoka, Nisshin, JP;

Takanori Teshima, Okazaki, JP;

Kuniaki Mamitsu, Nukata-gun, JP;

Inventors:

Daisuke Fukuoka, Nisshin, JP;

Takanori Teshima, Okazaki, JP;

Kuniaki Mamitsu, Nukata-gun, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 29/40 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 23/48 (2013.01); H01L 24/96 (2013.01); H01L 2224/73269 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0405 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73219 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.


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