Daisuke Fukuoka is a prominent inventor based in Kariya, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of electronic devices.

Latest Patents

Fukuoka's latest patents include a semiconductor device featuring wire pieces in the bonding member. This innovative design allows for improved connections between the semiconductor element and the wiring member. The bonding member is strategically designed to overlap with both the central and outer peripheral regions of the semiconductor element, ensuring optimal performance. Another notable patent involves an electronic device and a method for manufacturing it. This invention includes a unique inner lead of a signal terminal that utilizes a metal thin film and an uneven oxide film, enhancing the bonding process and overall device reliability.

Career Highlights

Daisuke Fukuoka is currently employed at Denso Corporation, a leading company in the automotive and electronics sectors. His work at Denso has allowed him to apply his innovative ideas in practical applications, contributing to the advancement of technology in the industry.

Collaborations

Fukuoka has collaborated with notable coworkers such as Takanori Teshima and Kuniaki Mamitsu. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Daisuke Fukuoka's contributions to semiconductor technology exemplify the impact of innovation in the electronics field. His patents reflect a commitment to improving device performance and reliability.

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