The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Aug. 17, 2010
Daisuke Fukuoka, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Kuniaki Mamitsu, Nukata-gun, JP;
Ken Sakamoto, Chiryu, JP;
Tetsuo Fujii, Toyohashi, JP;
Akira Tai, Okazaki, JP;
Kazuo Akamatsu, Okazaki, JP;
Masayoshi Nishihata, Chiryu, JP;
Daisuke Fukuoka, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Kuniaki Mamitsu, Nukata-gun, JP;
Ken Sakamoto, Chiryu, JP;
Tetsuo Fujii, Toyohashi, JP;
Akira Tai, Okazaki, JP;
Kazuo Akamatsu, Okazaki, JP;
Masayoshi Nishihata, Chiryu, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film.