The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
May. 09, 2016
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventor:
Daisuke Fukuoka, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H02M 7/44 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 29/16 (2006.01); H01L 27/06 (2006.01); H01L 23/051 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H02M 7/44 (2013.01); H01L 23/051 (2013.01); H01L 23/4334 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49568 (2013.01); H01L 27/0664 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 29/7395 (2013.01); H01L 29/861 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 2224/33 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip, a metal member, and a terminal. The semiconductor chip has an electrode. The metal member is electrically connected to the electrode. The terminal extends from the metal member to be connected to an external connection member. The terminal has a width-increased portion in a predetermined area beginning from a first end of the terminal that connects to the metal member.