The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jan. 25, 2012
Applicants:
Kuniaki Mamitsu, Okazaki, JP;
Takanori Teshima, Okazaki, JP;
Inventors:
Kuniaki Mamitsu, Okazaki, JP;
Takanori Teshima, Okazaki, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 25/11 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 25/117 (2013.01); H01L 23/40 (2013.01); H01L 23/473 (2013.01); H01L 25/115 (2013.01); H05K 7/20927 (2013.01); H01L 23/4012 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.