The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Oct. 08, 2004
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
Yoshimi Nakase, Anjo, JP;
Takanori Teshima, Okazaki, JP;
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
Yoshimi Nakase, Anjo, JP;
Takanori Teshima, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer for connecting to a second region of the semiconductor part; a blocking member electrically isolated from the control wiring layer; a first metallic layer; a protection film disposed among the main electrode, the control wiring layer and the blocking member; and a metal block for connecting to the main electrode through the first metallic layer. The chip, the main electrode, the control wiring layer, the blocking member, and the metal block are packaged. The blocking member is disposed between the main electrode and the control wiring layer.