The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
Feb. 06, 2007
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A method for manufacturing a mold type semiconductor device is provided. The device includes a semiconductor chip having a semiconductor part and a metallic member connecting to the chip via a conductive layer and a connecting member. The method includes: forming the semiconductor part on a semiconductor substrate so that a cell portion is provided; forming the conductive layer on the substrate; forming a first resist layer to cover a part of the conductive layer corresponding to the cell portion; etching the conductive layer with the first resist layer as a mask so that a first conductive layer is provided; removing the first resist layer and forming a second conductive layer to cover a surface and an edge of the first conductive layer. The second conductive layer has a Young's modulus equal to or larger than the semiconductor substrate.