The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Jul. 22, 2004
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Kuniaki Mamitsu, Okazaki, JP;
Yoshimi Nakase, Anjo, JP;
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Kuniaki Mamitsu, Okazaki, JP;
Yoshimi Nakase, Anjo, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.