The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2007
Filed:
Sep. 07, 2006
Tomomi Okumura, Nukata-gun, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Naohiko Hirano, Okazaki, JP;
Kuniaki Mamitsu, Okazaki, JP;
Tomomi Okumura, Nukata-gun, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Naohiko Hirano, Okazaki, JP;
Kuniaki Mamitsu, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor device includes: first and second metallic plates, each of which includes a heat radiation surface and an inner surface; a semiconductor element between the metallic plates; a block between the second metallic plate and the semiconductor element; a solder member between the second metallic plate and the block; and a resin mold. The heat radiation surface is exposed from the resin mold. The second metallic plate includes a groove for preventing the solder member from expanding outside of the block. The groove is disposed on the inner surface and disposed on an outer periphery of the block. The second metallic plate further includes an inner surface member on an inner surface of the groove. The inner surface member has a solder wettability, which is larger than a solder wettability of the block.