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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Ming-Hsiang Cheng

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 61(Granted Patents)


Company Filing History:

goldMedal14 out of 1,872 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2007-2019

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14 patents (USPTO):Explore Patents
1. 10332848 - Semiconductor package device and method of manufacturing the same (2019-06-25),
2. 9859232 - Semiconductor package device and method of manufacturing the same (2018-01-02),
3. 8592982 - Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof (2013-11-26),
4. 8421242 - Semiconductor package (2013-04-16),
5. 8368216 - Semiconductor package (2013-02-05),
6. 8274149 - Semiconductor device package having a buffer structure and method of fabricating the same (2012-09-25),
7. 8253431 - Apparatus and method for testing non-contact pads of a semiconductor device to be tested (2012-08-28),
8. 8222733 - Semiconductor device package (2012-07-17),
9. 8222726 - Semiconductor device package having a jumper chip and method of fabricating the same (2012-07-17),
10. 8072064 - Semiconductor package and method for making the same (2011-12-06),
11. 7699547 - Compact camera module (2010-04-20),
12. 7446295 - Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip (2008-11-04),
13. 7429783 - Image sensor package (2008-09-30),
14. 7279789 - Thermally enhanced three-dimensional package and method for manufacturing the same (2007-10-09),

Title: Innovations of Ming-Hsiang Cheng in Semiconductor Technology

Introduction

Ming-Hsiang Cheng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on innovative semiconductor package devices and methods of manufacturing them.

Latest Patents

One of his latest patents is a semiconductor package device and method of manufacturing the same. This invention provides a semiconductor package device that includes a substrate with a first area and a second area. A semiconductor device is placed on the first area of the substrate, while an antenna pattern is located on the second area. Additionally, a first electronic component is positioned on the antenna pattern. The first package body encapsulates the first area of the substrate and the semiconductor device, while exposing the antenna pattern, the first electronic component, and the second area of the substrate. Notably, the upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.

Career Highlights

Ming-Hsiang Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative approach have positioned him as a key figure in the industry.

Collaborations

Throughout his career, Cheng has collaborated with notable colleagues, including Tsung-Yueh Tsai and Yi-Shao Lai. These partnerships have further enhanced his contributions to semiconductor technology.

Conclusion

Ming-Hsiang Cheng's work in semiconductor technology exemplifies innovation and dedication. His patents and collaborations reflect his commitment to advancing the field, making him a significant contributor to the industry.

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