The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2008

Filed:

Sep. 19, 2006
Applicants:

Jian-cheng Chen, Tainan Hsien, TW;

Ming-hsiang Cheng, Kaohsiung, TW;

Chia-jung Lee, Kaohsiung, TW;

Inventors:

Jian-Cheng Chen, Tainan Hsien, TW;

Ming-Hsiang Cheng, Kaohsiung, TW;

Chia-Jung Lee, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.


Find Patent Forward Citations

Chen, Jian-Cheng. (2008). Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip (U.S. Patent No. 7446295). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7446295

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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