The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Dec. 31, 2009
Hsiao-chuan Chang, Kaohsiung, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Yi-shao Lai, Yonghe, TW;
Chang-lin Yeh, Hsinchu, TW;
Ming-hsiang Cheng, Kaohsiung, TW;
Hsiao-Chuan Chang, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Yi-Shao Lai, Yonghe, TW;
Chang-Lin Yeh, Hsinchu, TW;
Ming-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package is provided. The semiconductor package includes an organic substrate, a stiffness layer, and a chip subassembly. The stiffness layer is formed on the organic substrate. The chip subassembly is disposed on the stiffness layer. The chip subassembly includes at least a first chip, a second chip, and a third chip. The second chip is disposed between the first chip and the third chip in a stacked orientation. The first chip, the second chip, and the third chip have the function of proximity communication.