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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Tsung-Yueh Tsai

This inventor holds 29 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Yueh Tsai. Retrieved from https://idiyas.com/inventor/tsung-yueh-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 96.6

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 119(Granted Patents)


Location History:

  • Gangshan Township, TW (2012)
  • Kaohsiung, TW (2004 - 2024)

Company Filing History:

goldMedal29 out of 1,964 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2004-2025

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Areas of Expertise:
Semiconductor Device
Optical Device
Fan-Out Ball Grid Array
LED Bulb
Buffer Structure
Jumper Chip
Quad Flat No Lead
Bonding Strength
Stacked Chip
Cooling System
29 patents (USPTO):Explore Patents
1. 12272671 - Semiconductor device package and method for manufacturing the same (2025-04-08),
2. 12009353 - Optical device package with compatible lid and carrier (2024-06-11),
3. 11776889 - Semiconductor package device and method of manufacturing the same (2023-10-03),
4. 11764311 - Optical device and electronic device (2023-09-19),
5. 11682653 - Semiconductor device package and method for manufacturing the same (2023-06-20),
6. 11302682 - Optical device package (2022-04-12),
7. 11133423 - Optical device and method of manufacturing the same (2021-09-28),
8. 11024570 - Semiconductor package device and method of manufacturing the same (2021-06-01),
9. 10937761 - Semiconductor device package and method for manufacturing the same (2021-03-02),
10. 10545581 - Semiconductor package device (2020-01-28),
11. 10522505 - Semiconductor device package and method for manufacturing the same (2019-12-31),
12. 10242940 - Fan-out ball grid array package structure and process for manufacturing the same (2019-03-26),
13. 10147835 - Optical device and method of manufacturing the same (2018-12-04),
14. 9618191 - Light emitting package and LED bulb (2017-04-11),
15. 8592982 - Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof (2013-11-26),

Title: The Innovative Journey of Inventor Tsung-Yueh Tsai

Introduction:

Tsung-Yueh Tsai, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Tsung-Yueh Tsai's latest patents include cutting-edge advancements in renewable energy technology, artificial intelligence systems, and sustainable agriculture practices, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

With a career spanning over two decades, Tsung-Yueh Tsai has established himself as a pioneer in the tech industry, holding numerous patents that have revolutionized various sectors. His dedication to pushing the boundaries of innovation has earned him recognition on both a national and international level.

Collaborations:

Throughout his career, Tsung-Yueh Tsai has collaborated with leading research institutions, universities, and tech companies to further develop and implement his inventions. His ability to work effectively in multidisciplinary teams has been instrumental in bringing his ideas to life and making a tangible impact on society.

Conclusion:

Inventor Tsung-Yueh Tsai's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary in the world of technology. His work continues to inspire future generations of inventors and serves as a testament to the power of human ingenuity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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