The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Oct. 05, 2017
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Jen-Kai Ou, Kaohsiung, TW;
Meng-Jen Wang, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Chih-Ming Hung, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/02 (2006.01); G06F 3/041 (2006.01); H01L 41/053 (2006.01); H01L 41/23 (2013.01); H01L 41/319 (2013.01); H01L 41/293 (2013.01); G06F 3/01 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0202 (2013.01); G06F 3/016 (2013.01); G06F 3/0414 (2013.01); H01L 41/053 (2013.01); H01L 41/23 (2013.01); H01L 41/293 (2013.01); H01L 41/319 (2013.01);
Abstract
An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.