The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Mar. 07, 2013
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Hsiao-Chuan Chang, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); F21V 29/77 (2015.01); F21Y 105/12 (2016.01); F21Y 105/10 (2016.01); F21K 9/23 (2016.01); F21Y 115/10 (2016.01); F21Y 107/00 (2016.01);
U.S. Cl.
CPC ...
F21V 19/003 (2013.01); F21V 29/77 (2015.01); F21K 9/23 (2016.08); F21Y 2105/10 (2016.08); F21Y 2105/12 (2016.08); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); Y10T 29/49002 (2015.01);
Abstract
A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.