The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Oct. 04, 2011
Yi-shao Lai, Taipei, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Ming-kun Chen, Kaohsiung, TW;
Tai-ping Wang, New Taipei, TW;
Ming-hsiang Cheng, Kaohsiung, TW;
Yi-Shao Lai, Taipei, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Ming-Kun Chen, Kaohsiung, TW;
Tai-Ping Wang, New Taipei, TW;
Ming-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.