The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Mar. 29, 2010
Hsiao-chuan Chang, Kaohsiung, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Yi-shao Lai, Yonghe, TW;
Jiunn Chen, Kaohsiung, TW;
Ming-hsiang Cheng, Kaohsiung, TW;
Hsiao-Chuan Chang, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Yi-Shao Lai, Yonghe, TW;
Jiunn Chen, Kaohsiung, TW;
Ming-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.