The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Dec. 07, 2005
Ming-hsiang Cheng, Kao-Hsiung, TW;
Ming-Hsiang Cheng, Kao-Hsiung, TW;
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Abstract
A thermally enhanced three-dimensional (3D) package is disclosed. The package includes a heat sink having an opening and a stiffener ring inside the opening. The stiffener ring has a first surface and a second surface. A first substrate of a first package is disposed inside the opening and secured to the first surface of the stiffener ring. A second substrate of a second chip package is secured to the second surface of the stiffener ring. The first substrate is connected to the second substrate through a plurality of solder balls. The heat generated in the first chip package and the second chip package is dissipated by the heat sink. The first chip package and the second chip package are fixed by the stiffener ring to eliminate warpage of the first chip package and the second chip package, thereby assuring the electrical transmission of the product.