The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Mar. 29, 2010
Hsiao-chuan Chang, Kaohsiung, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Yi-shao Lai, Yonghe, TW;
Ming-hsiang Cheng, Kaohsiung, TW;
Hsiao-Chuan Chang, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Yi-Shao Lai, Yonghe, TW;
Ming-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a buffer structure, two active chips and a bridge chip. The substrate has a cavity, a first surface and a second surface opposite to the first surface. The cavity is extended from the first surface toward the second surface, and the buffer structure is disposed in the cavity. The active chips are disposed on and electrically connected to the first surface and around the cavity. The active chips both have a first active surface. The bridge chip is disposed in the cavity and above the buffer structure. The bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the active chips.