The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
May. 20, 2010
Yi-shao Lai, Kaohsiung, TW;
Tsung-yueh Tsai, Kaohsiung, TW;
Ming-kun Chen, Kaohsiung, TW;
I. L. Lin, Kaohsiung, TW;
Ken Juang, Kaohsiung, TW;
Ming-hsiang Cheng, Kaohsiung, TW;
Yi-Shao Lai, Kaohsiung, TW;
Tsung-Yueh Tsai, Kaohsiung, TW;
Ming-Kun Chen, Kaohsiung, TW;
I. L. Lin, Kaohsiung, TW;
Ken Juang, Kaohsiung, TW;
Ming-Hsiang Cheng, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip.