Eggersdorf, Austria

Martin Schrems

This inventor holds 69 USPTO granted patents and 4 published patent applications and 26 EPO patents, primarily in Semiconductor Devices (CPC class H01L). Top assignees: Ams Ag, Infineon Technologies Ag, Siemens Aktiengesellschaft. Active years: 1999-2026.

USPTO Granted Patents = 69 

% Patents Active = 71.0

 

Average Co-Inventor Count = 2.5

ph-index = 13

Forward Citations = 554(Granted Patents)

Forward Citations (Not Self Cited) = 535(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Langenbruck, DE (2000)
  • Langebrück/Dresden, AT (2001)
  • Langerbrück, DE (2001)
  • Langebrueck, DE (1999 - 2002)
  • Langenbrueck, DE (2002)
  • Longebrück/Dresden, DE (2003)
  • Langenbrück, DE (2001 - 2004)
  • Langebrück, DE (2001 - 2005)
  • Eggersdorf B. Graz, AT (2002 - 2006)
  • Eddersdorf, AT (2017)
  • Premstaetten, AT (2022)
  • Höf-Präbach, AT (2022)
  • Eggersdorf, AT (2003 - 2024)

Company Filing History:


Years Active: 1999-2026

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Areas of Expertise:
System-On-Chip Camera
Optical Sensor
Pressure Sensor
RF Functionality
Single-Photon Avalanche Diode
Through-Substrate Via
Trench Capacitor
MEMS Microphone
Thermal Decoupling
Dicing Method
Interposer-Chip-Arrangement
Semiconductor Memory Cell
69 patents (USPTO):Explore Patents

Title: Martin Schrems: A Maverick Inventor Leaving a Mark on the Electronics Industry

Introduction:

Meet Martin Schrems, an Austrian inventor with an impressive list of accomplishments in the field of electronics. With over 60 patents to his name, Schrems has made significant contributions to the industry. Let's dive into some of his latest patents, his work experience with prestigious companies, and his collaboration with notable coworkers.

Patents:

Among Schrems' notable recent patents is an electronic module with single or multiple components partially surrounded by a thermal decoupling gap. This invention involves an electronic device that includes component carriers connected in a way that forms a thermal decoupling gap, providing effective thermal management and preventing heat transfer between components. This innovation has the potential to enhance the performance and reliability of electronic systems.

Another significant patent by Schrems is the system-on-chip camera with integrated light sensor(s). This invention combines a semiconductor body, sensor substrates, sensor elements, light sensors, and lens arrangements to create a compact camera system. By integrating various components into a single chip, this innovation simplifies camera designs and facilitates the production process.

Work Experience:

Throughout his career, Schrems has worked for renowned companies, including Infineon Technologies AG and Siemens Aktiengesellschaft. These companies are recognized leaders in the electronics industry, known for their groundbreaking innovations. Schrems' experience at these prestigious organizations undoubtedly played a crucial role in shaping his innovative mindset and technical expertise.

Collaboration:

Schrems has collaborated with exceptional individuals who have contributed to his research and inventions. Two such coworkers of note are Franz Schrank and Jochen Kraft. Their collaborative efforts have likely led to the development of breakthrough technologies and further boosted Schrems' success as an inventor.

Conclusion:

Martin Schrems is a highly accomplished inventor with a remarkable record of over 60 patents in the electronics industry. His innovative contributions, particularly in thermal management and camera technology, have the potential to shape the future of electronic devices. With an impressive work history at companies like Infineon Technologies AG and Siemens Aktiengesellschaft, and collaborations with talented coworkers, Schrems continues to push the boundaries of what's possible in the field of electronics. As we eagerly await his next invention, it is clear that Schrems is a true powerhouse in the world of innovation.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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