The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Nov. 09, 2018
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Marco Gavagnin, Leoben, AT;
Markus Leitgeb, Trofaiach, AT;
Martin Schrems, Eggersdorf, AT;
Roland Winkler, Semriach, AT;
Steve Anderson, Leoben, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 21/66 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 23/13 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 24/97 (2013.01); H01L 21/486 (2013.01); H01L 22/12 (2013.01); H01L 23/5384 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/95001 (2013.01);
Abstract
A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.