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Leoben, Austria

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

USPTO Granted Patents = 238

EPO Patents = 131

Trademarks = 4

Forward Citations = 306

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204 inventors (with patents filed for the assignee):

Johannes Stahr (43 out of 46 patents)

Markus Leitgeb (34 out of 36 patents)

Andreas Zluc (27 out of 28 patents)

4. Gerald Weidinger (26 out of 26 patents)

5. Jonathan Silvano De Sousa (19 out of 22 patents)

6. Marco Gavagnin (17 out of 17 patents)

7. Mikael Tuominen (16 out of 36 patents)

8. Gernot Grober (16 out of 16 patents)

9. Christian Vockenberger (15 out of 17 patents)

10. Gerald Weis (13 out of 13 patents)

11. Erich Schlaffer (13 out of 13 patents)

12. Abderrazzaq Ifis (13 out of 14 patents)

13. Heinz Moitzi (12 out of 13 patents)

14. Mike Morianz (11 out of 13 patents)

15. Alexander Kasper (11 out of 11 patents)

Core Competencies:

Component Carrier

Embedded Components

Dielectric Layer

Interconnection Technology

Magnetic Inlay

Printed Circuit Boards

Thermal Management

Manufacturing Methods

Microwave Applications

Inductive Elements

AI-Based Manufacturing

Stacked Connections

238 patents: Sort by Forward Citations

1. 12495498 - Component carrier interconnection and manufacturing method (2025-12-09),

2. 12490382 - Coreless component carrier with embedded components (2025-12-02),

3. 12484154 - Inlay with exposed porous layer, component carrier and manufacturing methods (2025-11-25),

4. 12482595 - Component carrier with embedded magnetic inlay and integrated coil structure (2025-11-25),

5. 12471203 - Interconnection of printed circuit boards with nanowires (2025-11-11),

6. 12464649 - Component carrier with inductive element included in layer build-up, and manufacturing method (2025-11-04),

7. 12463124 - Component carrier with surface mounted components connected by high density connection region (2025-11-04),

8. 12424504 - Component embedded in component carrier and having an exposed side wall (2025-09-23),

9. 12402258 - Direct resin embedding (2025-08-26),

10. 12400968 - Component with dielectric layer for embedding in component carrier (2025-08-26),

11. 12396091 - Component carrier with a via containing a hardened filling material (2025-08-19),

12. 12381138 - Component carrier with a photoimageable dielectric layer and a structured conductive layer being used as a mask for selectively exposing the photoimageable dielectric layer with electromagnetic radiation (2025-08-05),

13. 12324091 - Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface (2025-06-03),

14. 12322622 - Component carrier with gap around component core and filled with first material in bottom portion and with second material in top portion (2025-06-03),

15. 12295108 - Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers (2025-05-06),

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft is one of the largest manufacturers of printed circuit boards and IC substrates in the world. The company operates through its two segments: Mobile Devices and Automotive, Industrial, Medical. AT&S serves customers in numerous industries, including telecommunications, automotive electronics, aerospace, and medical technology. With a global presence and cutting-edge technology, AT&S is committed to delivering innovative and reliable solutions to its clients.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

238 Patents

#1 in Leoben

#14 in Austria

#3,485 in the World

Leoben, Austria

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Forward Citations = 306

204 inventors:

Johannes Stahr (43 out of 46 patents)

Markus Leitgeb (34 out of 36 patents)

Andreas Zluc (27 out of 28 patents)

4. Gerald Weidinger (26 out of 26 patents)

5. Jonathan Silvano De Sousa (19 out of 22 patents)

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