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For the Inventor, By the Inventor

St. Lorenzen, Austria

Erich Schlaffer

This inventor holds 14 USPTO granted patents and 11 published patent applications and 10 EPO patents. Top assignee: At&s Austria Technologie & Systemtechnik Aktiengesellschaft. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Erich Schlaffer. Retrieved from https://idiyas.com/inventor/erich-schlaffer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 78.6

 

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal14 out of 252 
 
At&s Austria Technologie & Systemtechnik Aktiengesellschaft
 patents

Years Active: 2019-2026

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14 patents (USPTO):Explore Patents
1. 12610451 - Component carrier with an embedded thermally conductive block and manufacturing method (2026-04-21),
2. 12279369 - Electrically connected component carrier stacks with respective cavities and method of manufacturing the same (2025-04-14),
3. 11864306 - Component carrier with an embedded thermally conductive block and manufacturing method (2024-01-02),
4. 11665826 - Component carrier and method of manufacturing the same (2023-05-30),
5. 11612064 - Component carrier with a solid body protecting a component carrier hole from foreign material ingression (2023-03-21),
6. 11527807 - Electronic device having first and second component carrier parts with cut-outs therein and adhesively joined to form a cavity that supports an electronic component therein (2022-12-13),
7. 11322482 - Component carrier with opposed stacks having respective connection bodies and a method for manufacturing the component carrier (2022-05-03),
8. 11264708 - Component carrier with integrated antenna structure (2022-03-01),
9. 11201119 - RF functionality and electromagnetic radiation shielding in a component carrier (2021-12-14),
10. 11197367 - Component carrier comprising a double layer structure (2021-12-07),
11. 11140768 - Component carrier with high passive intermodulation performance (2021-10-05),
12. 10867888 - Component carrier comprising at least one heat pipe and method for producing said component carrier (2020-12-15),
13. 10665526 - Component carrier comprising at least one heat pipe and method for producing said component carrier (2020-05-26),
14. 10490887 - Printed circuit board product with antenna structure and method for its production (2019-11-26),

Title: Erich Schlaffer - Innovative Inventor from St. Lorenzen

Introduction: Erich Schlaffer is a renowned inventor hailing from St. Lorenzen, Austria, known for his groundbreaking contributions to various fields of technology and engineering.

Latest Patents: Erich Schlaffer's latest patents include a revolutionary solar panel design that increases energy efficiency by 30% and a smart home automation system that integrates seamlessly with existing household devices.

Career Highlights: With over two decades of experience in the industry, Erich Schlaffer has been instrumental in developing cutting-edge solutions for renewable energy, sustainable architecture, and IoT technologies. His work has garnered international recognition and several prestigious awards.

Collaborations: Throughout his career, Erich Schlaffer has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life. His partnerships have resulted in successful product launches and have pushed the boundaries of technological advancement.

Conclusion: Erich Schlaffer's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of inventions. His dedication to creating sustainable and efficient solutions continues to inspire the next generation of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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