The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Mar. 07, 2018
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Fabrizio Gentili, Graz, AT;

Sebastian Sattler, Graz, AT;

Wolfgang Bösch, Graz, AT;

Erich Schlaffer, St. Lorenzen, AT;

Markus Kastelic, Zeltweg, AT;

Bernhard Reitmaier, Pölstal/Möderbrugg, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/087 (2013.01); H01P 3/084 (2013.01); H01P 11/003 (2013.01); H05K 1/024 (2013.01); H05K 1/0243 (2013.01); H05K 3/386 (2013.01); H05K 3/4611 (2013.01); H05K 3/4697 (2013.01);
Abstract

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.


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