The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

May. 07, 2021
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Erich Schlaffer, St. Lorenzen, AT;

Markus Steinkellner, St. Margarethen, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/00 (2006.01); H01L 21/67 (2006.01); H01L 21/70 (2006.01); H01L 21/768 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3431 (2013.01); H05K 3/429 (2013.01); H05K 3/0047 (2013.01);
Abstract

A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.


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