St. Margarethen, Austria

Markus Steinkellner

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: At&s Austria Technologie & Systemtechnik Aktiengesellschaft. Active years: 2023.


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of Markus Steinkellner

Introduction

Markus Steinkellner is an accomplished inventor based in St. Margarethen, Austria. He has made significant contributions to the field of component carriers, showcasing his expertise through his innovative patent. His work is characterized by a focus on enhancing the functionality and reliability of electronic components.

Latest Patents

Markus Steinkellner holds a patent for a "Component carrier with a solid body protecting a component carrier hole from foreign material ingression." This invention includes a first stack with at least one electrically conductive or insulating layer structure, a hole formed within the first stack, and a non-deformable solid body that closes a portion of the hole while maintaining a gap from the side walls. The patent also describes a component carrier assembly that connects two stacks, along with methods for manufacturing such components.

Career Highlights

Markus Steinkellner is associated with AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of technology and system solutions. His role at AT&S has allowed him to work on cutting-edge technologies and contribute to advancements in electronic component design.

Collaborations

One of his notable collaborators is Erich Schlaffer, with whom he has worked closely on various projects. Their partnership has fostered innovation and development in their respective fields.

Conclusion

Markus Steinkellner's contributions to the field of component carriers highlight his innovative spirit and dedication to advancing technology. His patent reflects a significant step forward in protecting electronic components from foreign material, showcasing his expertise and commitment to excellence.

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