The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Jun. 04, 2020
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Bernhard Reitmaier, Pölstal/Möderbrugg, AT;

Sebastian Sattler, Graz, AT;

Erich Schlaffer, St. Lorenzen, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/50 (2006.01); H01L 21/768 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/50 (2013.01); H01L 21/76802 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/64 (2013.01);
Abstract

A component carrier with a first stack and a second stack. The first stack includes at least one first electrically insulating layer structure and at least one first electrically conductive layer structure having a first connection body with a first exposed planar electrically conductive surface. The second stack includes at least one second electrically insulating layer structure and at least one second electrically conductive layer structure having a second connection body with a second exposed planar electrically conductive surface. The first stack and the second stack are connected with each other so that the first exposed planar electrically conductive surface and the second exposed planar electrically conductive surface are connected to establish a vertical two-dimensional electrically conductive connection.


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