At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Erich Schlaffer

Bernhard Reitmaier

Jonathan Silvano De Sousa

Sebastian Sattler

Johannes Stahr

Gernot Grober

Markus Leitgeb

Gerald Weidinger

Martin Schrems

Marco Gavagnin

Mike Morianz

Heinz Moitzi

Thomas Krivec

Wolfgang Schrittwieser

Alexander Kasper

Gernot Schulz

Ferdinand Lutschounig

Thomas Kristl

Steve Anderson

Rainer Frauwallner

Markus Kastelic

Kevin Pöltl

Rene Oberegger

Konrad Klaus

Martin Reiter

Fabrizio Gentili

Wolfgang Bösch

Gernot Gmundner

Markus Steinkellner

A component carrier includes a first stack having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, and a second stack with at least one second electrically insulating layer structure and at least one second electrically conductive layer structure. The first stack and the second stack are connected with each other so that a vertical two-dimensional electrically conductive connection is established. The first stack has a first cavity and the second stack has a second cavity, the first cavity and the second cavity being separated by at least one further electrically insulating layer structure. At least one of the first cavity and the second cavity is delimited by a wall being at least partially lined with an electrically conductive coating.

Electrically connected component carrier stacks with respective cavities and method of manufacturing the same

A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

Component carrier with an embedded thermally conductive block and manufacturing method

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.

Component carrier and method of manufacturing the same

A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.

Component carrier with a solid body protecting a component carrier hole from foreign material ingression

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

Electronic device having first and second component carrier parts with cut-outs therein and adhesively joined to form a cavity that supports an electronic component therein

A component carrier with a first stack and a second stack. The first stack includes at least one first electrically insulating layer structure and at least one first electrically conductive layer structure having a first connection body with a first exposed planar electrically conductive surface. The second stack includes at least one second electrically insulating layer structure and at least one second electrically conductive layer structure having a second connection body with a second exposed planar electrically conductive surface. The first stack and the second stack are connected with each other so that the first exposed planar electrically conductive surface and the second exposed planar electrically conductive surface are connected to establish a vertical two-dimensional electrically conductive connection.

Component carrier with opposed stacks having respective connection bodies and a method for manufacturing the component carrier

An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.

Component carrier with integrated antenna structure

A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.

RF functionality and electromagnetic radiation shielding in a component carrier

A component carrier with a double layer structure is illustrated and described. The double layer structure includes an electrically conductive patterned layer structure and a further patterned layer structure made of a two-dimensional material. The patterned layer structure and the further patterned layer structure have at least partly the same pattern. In an embodiment the component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and at least one double layer structure connected with the stack.

Component carrier comprising a double layer structure

A component carrier which includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, and electrically conductive wiring structures being part of the at least one electrically conductive layer structure, wherein a value of the passive intermodulation for signals propagating along the electrically conductive wiring structures is less than &#x2212;153 dBc.

Component carrier with high passive intermodulation performance

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Component carrier comprising at least one heat pipe and method for producing said component carrier

A method for producing an intermediate printed circuit board product () with an antenna structure (), including steps of providing a ground layer () including optionally a release layer () that is removably positioned () on an antenna subarea () of an exterior side () of the ground layer (); attaching a dielectric insulating layer () on the exterior side () of the ground layer () that is if applicable partly covered by the release layer (); attaching a conducting layer () on an exterior side () of the dielectric insulating layer (); laminating of the layers () to receive a first semi-finished product (); manufacturing of an antenna cavity () throughout the conducting layer () and the dielectric insulating layer () with a ground-plane area () that is if applicable made up of the release layer (); attaching a compound signal layer () on the conducting layer () covering the antenna cavity (); and laminating of the layers () to receive the intermediate product ().

Growing community of inventors

St. Lorenzen, Austria

Erich Schlaffer