The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2019

Filed:

Feb. 23, 2017
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Erich Schlaffer, St. Lorenzen, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H05K 1/0222 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/282 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/06 (2013.01);
Abstract

A method for producing an intermediate printed circuit board product () with an antenna structure (), including steps of providing a ground layer () including optionally a release layer () that is removably positioned () on an antenna subarea () of an exterior side () of the ground layer (); attaching a dielectric insulating layer () on the exterior side () of the ground layer () that is if applicable partly covered by the release layer (); attaching a conducting layer () on an exterior side () of the dielectric insulating layer (); laminating of the layers () to receive a first semi-finished product (); manufacturing of an antenna cavity () throughout the conducting layer () and the dielectric insulating layer () with a ground-plane area () that is if applicable made up of the release layer (); attaching a compound signal layer () on the conducting layer () covering the antenna cavity (); and laminating of the layers () to receive the intermediate product ().


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