The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Apr. 17, 2020
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Jonathan Silvano de Sousa, Vienna, AT;

Bernhard Reitmaier, Möderbrugg, AT;

Erich Schlaffer, St. Lorenzen, AT;

Johannes Stahr, St. Lorenzen, AT;

Wolfgang Schrittwieser, Kapfenberg, AT;

Gerald Weidinger, Leoben, AT;

Alexander Kasper, Graz, AT;

Gernot Grober, Graz, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H05K 1/02 (2006.01); F21V 29/51 (2015.01); F28D 15/02 (2006.01); F28D 20/02 (2006.01); F28F 3/08 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F21V 29/51 (2015.01); F28D 15/0275 (2013.01); F28D 20/023 (2013.01); F28F 3/086 (2013.01); H01L 21/673 (2013.01); H05K 1/0203 (2013.01); H05K 1/0207 (2013.01); H05K 1/0272 (2013.01); H05K 1/0206 (2013.01); H05K 2201/064 (2013.01);
Abstract

The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.


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