Shanghai, China

Mikael Tuominen

This inventor holds 36 USPTO granted patents and 1 published patent application and 9 EPO patents, primarily in Component Carrier Technology. Top assignees: At&s (China) Co. Ltd., At&s Austria Technologie & Systemtechnik Aktiengesellschaft. Active years: 2016-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mikael Tuominen. Retrieved from https://idiyas.com/inventor/mikael-tuominen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 88.9

 

Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Minhang, CN (2020)
  • Shanghai, CN (2016 - 2022)
  • Pernio, FI (2021 - 2023)

Company Filing History:


Years Active: 2016-2023

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Areas of Expertise:
Component Carrier
Dielectric Material
Embedded Component
Circuit Board
Manufacturing Method
Thermal Management
Layer Structures
Stress Relief
Electrical Conductivity
Toughness Factor
Crosstalk Reduction
Flexible Design
36 patents (USPTO):Explore Patents

Title: Innovations and Achievements of Mikael Tuominen

Introduction: Mikael Tuominen, an inventive mind based in Shanghai, China, has made significant contributions to the field of technology and materials. With a total of 36 patents to his name, Tuominen has been at the forefront of developing innovative components that meet the needs of modern electronic systems.

Latest Patents: Mikael's latest inventions showcase his expertise in creating advanced component carriers. One of his notable patents is the "Component Carrier with Low Shrinkage Dielectric Material," which features a stack comprising at least one electrically conductive layer structure and one electrically insulating layer structure. This invention utilizes a dielectric material with a curing shrinkage value of less than 2%, thereby enhancing performance and reliability. Another significant patent is the "Component Carrier with Improved Bending Performance," which includes a bendable portion that is integral to the layer stack, featuring a metal layer that covers at least 75% of the area of that portion. This design allows for greater flexibility in electronic applications.

Career Highlights: Mikael has played a vital role in companies such as AT&S (China) Co. Ltd. and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. His work in these organizations has allowed him to apply his innovative thinking to real-world challenges, contributing to the advancement of technology in the component manufacturing industry.

Collaborations: Throughout his career, Mikael has collaborated with talented professionals, including Seok Kim Tay and Nick Xin. These collaborations have fostered innovation and have been instrumental in driving forward the projects they have undertaken together.

Conclusion: Mikael Tuominen continues to be a significant figure in the realm of innovations and patent development. His substantial portfolio of patents reflects his commitment to advancing technology and his ability to address the evolving demands of the electronic industry. His work not only showcases his talent as an inventor but also contributes to the greater body of knowledge in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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