The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Aug. 03, 2020
Applicant:

At&s (China) Co. Ltd., Shanghai, CN;

Inventors:

Mikael Tuominen, Pernio, FI;

Nick Xin, Shanghai, CN;

Seok Kim Tay, Singapore, SG;

Assignee:

AT&S (China) Co. Ltd., Shanghai, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/028 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 3/4691 (2013.01);
Abstract

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.


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