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For the Inventor, By the Inventor

Singapore, Singapore

Seok Kim Tay

This inventor holds 24 USPTO granted patents and 9 published patent applications and 4 EPO patents, primarily in Component Carrier Technology. Top assignees: At&s (China) Co. Ltd., At&s Austria Technologie & Systemtechnik Aktiengesellschaft, At&s (Chongqing) Company Limited. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seok Kim Tay. Retrieved from https://idiyas.com/inventor/seok-kim-tay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal13 out of 36 
 
At&s (China) Co. Ltd.
 patents
silverMedal10 out of 252 
 
At&s Austria Technologie & Systemtechnik Aktiengesellschaft
 patents
bronzeMedal1 out of 18 
 
At&s (Chongqing) Company Limited
 patents

Years Active: 2021-2025

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Areas of Expertise:
Component Carrier
Dielectric Material
Manufacturing Method
Embedded Component
High Elongation
Low Young Modulus
Electrically Conductive
Design Optimization
Traceability
Layer Structure
Quality Classification
Ultra-Thin Transition Layer
24 patents (USPTO):Explore Patents
1. 12490376 - Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the same (2025-12-02),
2. 12127338 - Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus (2024-10-22),
3. 12058810 - Semi-flex component carrier with dielectric material having high elongation and low young modulus (2024-08-06),
4. 12048101 - Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser (2024-07-23),
5. 12041730 - Component carrier with low-solvent fiber-free dielectric layer (2024-07-16),
6. 11963310 - Component carrier having component covered with ultra-thin transition layer (2024-04-16),
7. 11937369 - Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures (2024-03-19),
8. 11935221 - User interface for judgment concerning quality classification of displayed arrays of component carriers (2024-03-19),
9. 11778754 - Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure (2023-10-03),
10. 11688668 - Component carrier with low shrinkage dielectric material (2023-06-27),
11. 11670613 - Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method (2023-06-06),
12. 11617259 - Component carrier with embedded component exposed by blind hole (2023-03-28),
13. 11589462 - Semi-flexible component carrier with stepped layer structure (2023-02-21),
14. 11483927 - Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric (2022-10-25),
15. 11470714 - Component carrier with embedded component and horizontally elongated via (2022-10-11),

Title: Seok Kim Tay - Pioneering Inventor from Singapore

Introduction: Seok Kim Tay is a renowned inventor hailing from Singapore, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Seok Kim Tay holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Seok Kim Tay has demonstrated a remarkable ability to transform inventive ideas into tangible solutions that have positively impacted industries worldwide.

Collaborations: Seok Kim Tay has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Seok Kim Tay's relentless pursuit of innovation and his significant contributions to the technological landscape make him a true pioneer in the field of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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