The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2024

Filed:

Sep. 02, 2021
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Seok Kim Tay, Singapore, SG;

Mikael Tuominen, Pernio, FI;

Kim Liu, Kunshan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4655 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H05K 1/185 (2013.01); H05K 2203/111 (2013.01);
Abstract

A method of manufacturing a component carrier is described. The method includes forming a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and reducing an amount of solvent in a fiber-free dielectric layer, which is directly connected to a metal layer, so that the dielectric layer with reduced amount of solvent remains at least partially uncured.


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