The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Jan. 30, 2020
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Robin Zhang, Nanjing, CN;

Seok Kim Tay, Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H05K 1/115 (2013.01); H05K 1/186 (2013.01); H05K 3/423 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/1572 (2013.01);
Abstract

A component carrier includes an electrically insulating layer structure with a first main surface and a second main surface, a through hole extends through the electrically insulating layer structure between the first main surface and the second main surface. The through hole has a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface. The through hole is delimited by a first plating structure on at least part of the sidewalls of the electrically insulating layer structure and a second plating structure formed separately from and arranged on the first plating structure. The second plating structure includes an electrically conductive bridge structure connecting the opposing sidewalls.


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