Robin Zhang

Title: The Innovative Contributions of Robin Zhang

Introduction

Robin Zhang is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of component carriers, showcasing his expertise through his innovative patents. With a total of 2 patents, Zhang continues to push the boundaries of technology and design.

Latest Patents

Zhang's latest patents include a "Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure." This invention features an electrically insulating layer structure with a through hole that has tapering portions and is delimited by a plating structure. The second plating structure includes an electrically conductive bridge structure that connects the opposing sidewalls. Another notable patent is the "Component carrier with through hole extending through multiple dielectric layers." This patent describes a component carrier that includes a stack of electrically insulating layer structures with a through hole that is narrower in its inner portion compared to its exterior portions.

Career Highlights

Robin Zhang is currently employed at AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of technology and system solutions. His work at AT&S has allowed him to develop and refine his innovative ideas, contributing to the advancement of component carrier technology.

Collaborations

Zhang has collaborated with notable coworkers such as Seok Kim Tay and Mikael Tuominen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

In summary, Robin Zhang is an influential inventor whose work in component carrier technology has led to significant advancements in the field. His innovative patents and contributions to AT&S highlight his commitment to excellence and innovation.