The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Jan. 04, 2023
Applicant:

At&s (China) Co. Ltd., Shanghai, CN;

Inventors:

Diego Lorenzoni, Novara, IT;

Mikael Andreas Tuominen, Pernio, FI;

Seok Kim Tay, Singapore, SG;

Assignee:

AT&S (China) Co. Ltd., Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/188 (2013.01); H05K 3/4038 (2013.01); H05K 3/421 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A component carrier with an asymmetric build-up, which includes (a) a core; (b) a first stack at a first main surface of the core, the first stack having at least one first electrically conductive layer structure and a plurality of first electrically insulating layer structures; and (c) a second stack at a second main surface of the core, the second stack having at least one second electrically conductive layer structure and a plurality of second electrically insulating layer structures. At least two of the second electrically insulating layer structures are in direct contact with each other and each one of these electrically insulating layer structures has a smaller thickness than and/or includes a different material property than one of the first electrically insulating layer structures. Further described are methods for designing and manufacturing such an asymmetric component carrier.


Find Patent Forward Citations

Loading…