The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Apr. 30, 2019
Applicant:

At&s (China) Co. Ltd., Shanghai, CN;

Inventors:

Nick Xin, Shanghai, CN;

Mikael Andreas Tuominen, Pernio, FI;

Seok Kim Tay, Singapore, SG;

Assignee:

AT&S(China) Co. Ltd., Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/0393 (2013.01); H05K 3/4691 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09845 (2013.01);
Abstract

A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.


Find Patent Forward Citations

Loading…