The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Oct. 30, 2020
Applicant:
At&s (China) Co. Ltd., Shanghai, CN;
Inventors:
Mikael Tuominen, Pernio, FI;
Seok Kim Tay, Singapore, SG;
Assignee:
AT&S (China) Co. Ltd., Shanghai, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/485 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01L 23/29 (2006.01); H01L 23/48 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H01L 23/29 (2013.01); H01L 23/481 (2013.01); H05K 1/0298 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/0058 (2013.01); H01L 23/3114 (2013.01); H05K 7/023 (2013.01);
Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.