The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Nov. 12, 2019
Applicant:
At&s (China) Co. Ltd., Shanghai, CN;
Inventors:
Seok Kim Tay, Singapore, SG;
Mikael Tuominen, Shanghai, CN;
Assignee:
AT&S (China) Co. Ltd., Shanghai, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/22 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/186 (2013.01); H05K 3/22 (2013.01); H01L 23/5389 (2013.01); H05K 1/11 (2013.01); H05K 1/182 (2013.01); H05K 1/185 (2013.01); H05K 2201/0209 (2013.01);
Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component embedded in the stack so that a gap of less than 100 μm, in particular less than 60 μm, remains between at least one sidewall of the component and a sidewall of an adjacent one of the layer structures or a further component embedded in the stack; and a filler medium including filler particles, wherein the filler medium at least partially fills the gap. In addition, a method of manufacturing a component carrier is provided.