The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2022

Filed:

Dec. 24, 2020
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Mikael Tuominen, Pernio, FI;

Seok Kim Tay, Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/49894 (2013.01); H05K 1/024 (2013.01); H05K 1/185 (2013.01);
Abstract

A component carrier includes a stack having at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure. The first electrically insulating layer structure is made of a material which has first physical properties. The second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties. The first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other. A method of manufacturing a component carrier is also disclosed.


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