The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Aug. 03, 2021
Applicant:
At&s (China) Co. Ltd., Shanghai, CN;
Inventors:
Nick Xin, Shanghai, CN;
Mikael Tuominen, Pernio, FI;
Assignee:
AT&S (China) Co. Ltd., Shanghai, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/0393 (2013.01); H05K 1/181 (2013.01); H05K 1/0277 (2013.01); H05K 1/0278 (2013.01); H05K 1/0283 (2013.01); H05K 1/038 (2013.01); H05K 1/118 (2013.01); H05K 1/148 (2013.01); H05K 2201/046 (2013.01); H05K 2201/05 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01); H05K 2201/058 (2013.01);
Abstract
A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.