The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jun. 22, 2020
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Timo Schwarz, St. Michael I.O., AT;
Andreas Zluc, Leoben, AT;
Gregor Langer, Wölfnitz, AT;
Johannes Stahr, St. Lorenzen, AT;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 3/46 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/96 (2013.01); H01L 2924/181 (2013.01); H05K 1/0204 (2013.01); H05K 1/05 (2013.01); H05K 3/4602 (2013.01); H05K 3/4694 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/1469 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: