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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12463124 B1

PDFFull Text
Date of Patent:
Nov. 04, 2025

Filed:

Mar. 16, 2022

Component carrier with surface mounted components connected by high density connection region

Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Markus Leitgeb, Trofaiach, AT;

Gerhard Freydl, Leoben, AT;

Assignee:

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AU;

Attorneys:

Robert A. Blaha

Smith Tempel Blaha LLC

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are surface-mounted on the stack. The first component and the second component are electrically coupled with each other by the higher density connection region.

Find Patent Forward Citations

Leitgeb, Markus. (2025). Component carrier with surface mounted components connected by high density connection region (U.S. Patent No. 12463124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12463124

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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