The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Dec. 28, 2022
Applicant:

At&saustria Technologie & Systemtechnik Ag, Leoben, AT;

Inventors:

Bettina Schuster, Leoben, AT;

Jonathan Silvano De Sousa, Vienna, AT;

Andreas Zluc, Leoben, AT;

Markus Leitgeb, Trofaiach, AT;

Hannes Stahr, St. Lorenzen im Muerztal, AT;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G02B 6/42 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 3/00 (2006.01); H10F 77/50 (2025.01); H10H 20/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); G02B 6/4206 (2013.01); H01L 21/56 (2013.01); H05K 1/186 (2013.01); H05K 3/0044 (2013.01); H10F 77/50 (2025.01); H10H 20/8506 (2025.01);
Abstract

A method for manufacturing a component carrier includes i) providing a metal layer, in particular a copper layer; ii) forming a film on the metal layer; iii) patterning the film in order to expose a part of the metal layer; iv) carrying out a first etch, thereby thinning the film and removing a further part of the exposed metal layer; and thereafter v) carrying out a second etch, thereby forming at least one metal trace that is spatially separated from the metal layer. A component carrier made by the method is further described.


Find Patent Forward Citations

Loading…