The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Oct. 15, 2018
Applicant:

Ams Ag, Premstaetten, AT;

Inventors:

Gregor Toschkoff, Premstaetten, AT;

Thomas Bodner, Premstaetten, AT;

Franz Schrank, Premstaetten, AT;

Miklos Labodi, Premstaetten, AT;

Joerg Siegert, Premstaetten, AT;

Martin Schrems, Premstaetten, AT;

Assignee:

AMS AG, Premstaetten, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 27/146 (2006.01); G01J 1/02 (2006.01); G01J 1/04 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1876 (2013.01); G01J 1/0219 (2013.01); G01J 1/0407 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14698 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02161 (2013.01);
Abstract

A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.


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