The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Feb. 09, 2015
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
ams AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 24/11 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/05569 (2013.01);
Abstract
The dicing method comprises the steps of providing a substrate () of semiconductor material, the substrate having a main surface (), where integrated components () of chips () are arranged, and a rear surface () opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches () penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.