The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Oct. 06, 2017
Ams Ag, Unterpremstaetten, AT;
ams AG, Unterpremstaetten, AT;
Abstract
The method of producing an interposer-chip-arrangement, comprises providing an interposer () with an integrated circuit (), arranging a dielectric layer () with metal layers embedded in the dielectric layer above a main surface () of the interposer, connecting the integrated circuit with at least one of the metal layers, forming an interconnection () through the interposer, the interconnection contacting one of the metal layers, arranging a further dielectric layer () above a further main surface () of the interposer opposite the main surface and arranging a further metal layer in or on the further dielectric layer, the further metal layer being connected with the interconnection, arranging a chip provided with at least one contact pad at the main surface or at the further main surface, and electrically conductively connecting the contact pad with the interconnection.