The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Feb. 10, 2015
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
AMS AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01); H01L 27/14632 (2013.01); H01L 27/14634 (2013.01); H01L 27/14649 (2013.01); H01L 27/14687 (2013.01); H01L 27/14689 (2013.01); H01L 27/3269 (2013.01); H01L 31/0203 (2013.01); H01L 31/02016 (2013.01); H01L 27/14645 (2013.01); H01L 2924/1815 (2013.01);
Abstract
The semiconductor device comprises a semiconductor substrate (), a sensor or sensor array () arranged at a main surface () of the substrate, an integrated circuit () arranged at or above the main surface, and a focusing element () comprising recesses () formed within a further main surface () of the substrate opposite the main surface. The focusing element may be arranged opposite the sensor or sensor array (), which may be a photosensor or photodetector or an array of photosensors or photodetectors, for instance. The focusing element () is formed by etching the recesses () into the semiconductor material.